说明
无说明配置
无配置OEM 型号描述
The FEI V600CE is a focused ion beam (FIB) system designed for fast, efficient, and cost-effective circuit editing on advanced integrated circuits at the 65 nm technology node and beyond. It incorporates the latest developments in ion column design, gas delivery, and end point detection. Circuit editing allows product designers to reroute conductive pathways and test modified circuits in hours, rather than the weeks or months required to generate new masks and process new wafers. This results in fewer, shorter modification and test cycles, allowing manufacturers to ramp up new processes faster and be first to market with premium-priced new products. The V600CE is specifically designed to meet the challenges of advanced designs and processes, including smaller geometries, higher circuit densities, exotic materials, and complex interconnect structures. It can also be configured for backside editing with an optional IR microscope and bulk silicon trenching package.文件
无文件
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
V600CE
已验证
类别
TEM
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
13347
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
V600CE
类别
TEM
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
13347
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The FEI V600CE is a focused ion beam (FIB) system designed for fast, efficient, and cost-effective circuit editing on advanced integrated circuits at the 65 nm technology node and beyond. It incorporates the latest developments in ion column design, gas delivery, and end point detection. Circuit editing allows product designers to reroute conductive pathways and test modified circuits in hours, rather than the weeks or months required to generate new masks and process new wafers. This results in fewer, shorter modification and test cycles, allowing manufacturers to ramp up new processes faster and be first to market with premium-priced new products. The V600CE is specifically designed to meet the challenges of advanced designs and processes, including smaller geometries, higher circuit densities, exotic materials, and complex interconnect structures. It can also be configured for backside editing with an optional IR microscope and bulk silicon trenching package.文件
无文件