说明
无说明配置
无配置OEM 型号描述
The CHA Mark 50 is a high vacuum deposition system that has become the industry standard due to its simplicity in design, ease of operation and unmatched reliability. It’s an excellent choice for a wide range of applications. he CHA Mark 50 has a horizontal 32" by 32" water-cooled cylindrical chamber that simplifies loading and unloading. It also has a unique slide down front door that minimizes floor space requirements and a rear door that offers easy chamber access from behind for convenient through the wall mounting. It is SECS/GEM and CE compliant. Some of its features include dual operation (sputtering and evaporation), moving substrates, exceptional film uniformity (fixture dependent), sputter up process stations, round cathodes (RF or DC, up to 4 stations), co-deposit bias (RF or DC), substrate heating (400°C, multi-element), electron beam, thermal ion beam pre-clean/etch, plasma texturing/etch and power supply options.文件
无文件
CHA
MARK 50C
已验证
类别
Thermal Evaporators
上次验证： 20 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
114114
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CHA
MARK 50C
类别
Thermal Evaporators
上次验证： 20 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
114114
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The CHA Mark 50 is a high vacuum deposition system that has become the industry standard due to its simplicity in design, ease of operation and unmatched reliability. It’s an excellent choice for a wide range of applications. he CHA Mark 50 has a horizontal 32" by 32" water-cooled cylindrical chamber that simplifies loading and unloading. It also has a unique slide down front door that minimizes floor space requirements and a rear door that offers easy chamber access from behind for convenient through the wall mounting. It is SECS/GEM and CE compliant. Some of its features include dual operation (sputtering and evaporation), moving substrates, exceptional film uniformity (fixture dependent), sputter up process stations, round cathodes (RF or DC, up to 4 stations), co-deposit bias (RF or DC), substrate heating (400°C, multi-element), electron beam, thermal ion beam pre-clean/etch, plasma texturing/etch and power supply options.文件
无文件