说明
Measurement system配置
Vacuum chuck: 23.3 mm (small) and 33.4 mm (large) (2) Cassettes: 100 mm / 125 mm / 150 mm / 200 mm Wafer throughput: ~ 60 wafers/hour (150 mm) and ~ 45 wafer/hour (200 mm) Film thickness (Minimum): 5600 (150 mm) and 8700 (200 mm) Film thickness accuracy: ± 1.00 μm, 250 μm ~ 750 μm Topography test: 5600 (150 mm) and 8000 (200 mm) Topography test accuracy: ± (3.00+5% reading) μm (150 mm) and ± (4.00+5% reading) μm (200 mm) Topography test range: (950-t) μm ~ 650 μm Flatness test accuracy: ± 0.5 μm Flatness repeatable test deviation: 0.2 μm Stress repeatable test deviation: 1 x 10^7 dynes/cm² Stress test range: 1 × 10^7 ~ 1.4 x 10^12 dynes/cm² Film thickness test area: Within 3/5 mm (wafer edge) Topography test area: Within 3 mm (wafer edge) Operation Calibration Maintenance Safety manuals Paper and electronic documentation Gage controller Power supply: 120 V, 2.8 kVA, 50-60 HzOEM 型号描述
The ADE 9500 UltraGage is a benchmark in wafer geometry characterization, essential in device fabrication and silicon wafer manufacturing. It accurately measures thickness, flatness, bow/warp, and more, using noncontact methods with 10nm resolution, applicable to both patterned and polished wafers. This compact tool offers nondestructive control, with options for manual or cassette operation, and supports optional networking including SECS/GEM. Ideal for applications in photolithography, CMP, and other processes, the UltraGage is a versatile, high-performance metrology solution.文件
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KLA / ADE
ULTRAGAGE 9500
已验证
类别
Thin Film / Film Thickness
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
109981
晶圆尺寸：
4"/100mm, 8"/200mm
年份：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA / ADE
ULTRAGAGE 9500
类别
Thin Film / Film Thickness
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
109981
晶圆尺寸：
4"/100mm, 8"/200mm
年份：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Measurement system配置
Vacuum chuck: 23.3 mm (small) and 33.4 mm (large) (2) Cassettes: 100 mm / 125 mm / 150 mm / 200 mm Wafer throughput: ~ 60 wafers/hour (150 mm) and ~ 45 wafer/hour (200 mm) Film thickness (Minimum): 5600 (150 mm) and 8700 (200 mm) Film thickness accuracy: ± 1.00 μm, 250 μm ~ 750 μm Topography test: 5600 (150 mm) and 8000 (200 mm) Topography test accuracy: ± (3.00+5% reading) μm (150 mm) and ± (4.00+5% reading) μm (200 mm) Topography test range: (950-t) μm ~ 650 μm Flatness test accuracy: ± 0.5 μm Flatness repeatable test deviation: 0.2 μm Stress repeatable test deviation: 1 x 10^7 dynes/cm² Stress test range: 1 × 10^7 ~ 1.4 x 10^12 dynes/cm² Film thickness test area: Within 3/5 mm (wafer edge) Topography test area: Within 3 mm (wafer edge) Operation Calibration Maintenance Safety manuals Paper and electronic documentation Gage controller Power supply: 120 V, 2.8 kVA, 50-60 HzOEM 型号描述
The ADE 9500 UltraGage is a benchmark in wafer geometry characterization, essential in device fabrication and silicon wafer manufacturing. It accurately measures thickness, flatness, bow/warp, and more, using noncontact methods with 10nm resolution, applicable to both patterned and polished wafers. This compact tool offers nondestructive control, with options for manual or cassette operation, and supports optional networking including SECS/GEM. Ideal for applications in photolithography, CMP, and other processes, the UltraGage is a versatile, high-performance metrology solution.文件
无文件