说明
无说明配置
无配置OEM 型号描述
The NanoSpec 8300X is a film thickness measuring system designed by Nanometrics for the semiconductor industry. It was first introduced in July 1996 at the SEMICON/West trade show and is capable of handling both 200mm and 300mm diameter wafers. The system incorporates both a spectroscopic ellipsometer and spectrophotometer, enabling it to accurately measure and analyze virtually any dielectric film used in semiconductor manufacture today. The development of the NanoSpec 8300X was part of a project launched by SEMATECH, a consortium of large U.S. semiconductor manufacturers, to develop tools for the eventual industry shift to the manufacture of ICs on 300mm semiconductor wafers, which are designed to allow lower production cost due to the ability to simultaneously manufacture many more chips per wafer.文件
无文件
ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 8300X
已验证
类别
Thin Film / Film Thickness
上次验证： 30 多天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
114479
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 8300X
类别
Thin Film / Film Thickness
上次验证： 30 多天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
114479
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The NanoSpec 8300X is a film thickness measuring system designed by Nanometrics for the semiconductor industry. It was first introduced in July 1996 at the SEMICON/West trade show and is capable of handling both 200mm and 300mm diameter wafers. The system incorporates both a spectroscopic ellipsometer and spectrophotometer, enabling it to accurately measure and analyze virtually any dielectric film used in semiconductor manufacture today. The development of the NanoSpec 8300X was part of a project launched by SEMATECH, a consortium of large U.S. semiconductor manufacturers, to develop tools for the eventual industry shift to the manufacture of ICs on 300mm semiconductor wafers, which are designed to allow lower production cost due to the ability to simultaneously manufacture many more chips per wafer.文件
无文件