说明
Thin Film Thickness Measurement配置
无配置OEM 型号描述
The NanoSpec 9300 is a stand-alone, automated thin film measurement system that can handle both 200 and 300 millimeter diameter wafers. It can be configured with a DUV to NIR spectroscopic ellipsometer for ultrathin, multiple film stack, and DUV lithography measurement applications. Additionally, an FTIR option can be added to measure the thickness of epi-silicon. The system can also include a mini-environment enclosure and wafer load ports that are compatible with industry standards. The 9300 conforms to the new industry standards for 300 millimeter wafer handling automation and features a Windows NT software platform that conforms to the newly established SEMI user interface standard. The 9300 was developed using technologies from integrated film thickness systems, allowing for easy transfer of measurement recipes between integrated and stand-alone film metrology systems.文件
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ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 9300
已验证
类别
Thin Film / Film Thickness
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115101
晶圆尺寸：
12"/300mm
年份：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 9300
类别
Thin Film / Film Thickness
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115101
晶圆尺寸：
12"/300mm
年份：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Thin Film Thickness Measurement配置
无配置OEM 型号描述
The NanoSpec 9300 is a stand-alone, automated thin film measurement system that can handle both 200 and 300 millimeter diameter wafers. It can be configured with a DUV to NIR spectroscopic ellipsometer for ultrathin, multiple film stack, and DUV lithography measurement applications. Additionally, an FTIR option can be added to measure the thickness of epi-silicon. The system can also include a mini-environment enclosure and wafer load ports that are compatible with industry standards. The 9300 conforms to the new industry standards for 300 millimeter wafer handling automation and features a Windows NT software platform that conforms to the newly established SEMI user interface standard. The 9300 was developed using technologies from integrated film thickness systems, allowing for easy transfer of measurement recipes between integrated and stand-alone film metrology systems.文件
无文件