说明
Description FUSION 150/3D Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Power Requirements 380 V 14.0 A 50 Hz 3 Phase配置
无配置OEM 型号描述
The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.文件
无文件
类别
UV-Curing
上次验证： 今天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
121204
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
1996
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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AXCELIS / FUSION
200 PCU
类别
UV-Curing
上次验证： 今天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
121204
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
1996
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Description FUSION 150/3D Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Power Requirements 380 V 14.0 A 50 Hz 3 Phase配置
无配置OEM 型号描述
The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.文件
无文件