说明
Dimensions / Weight (approx. values) 1066 / 745 / 1380 350 kg Included: Pump: Pfeifer MVP 070-3 (defective)配置
Audit to verify The AWB has the versatility to perform aligned Anodic, Eutectic, Direct (High & Low Temperature) Glass frit, Adhesive, Solder & Thermo-compression wafer bonding. Alignment & bonding in one machine - Wafer size 8" - 8" standard IR platens for forces up to 15kN - IR and vis alignment - Twin Microscope ? camera system with through the-lens illumination. Two CCD cameras and side-by side display of images. Including IR capability. - In-situ alignment up to 1 micron accuracy - 10-6mbar Vacuum to 2bar process gas - forced nitrogen cooling - Voltage up to 2.5kV - Temperature up to 560° C - Semi-automatic PC control & data acquisitionOEM 型号描述
Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading文件
无文件
类别
Wafer Bonders
上次验证： 21 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
146031
晶圆尺寸：
8"/200mm
年份：
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MICROENGINEERING LTD (AML)
AWB-08
类别
Wafer Bonders
上次验证： 21 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
146031
晶圆尺寸：
8"/200mm
年份：
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Dimensions / Weight (approx. values) 1066 / 745 / 1380 350 kg Included: Pump: Pfeifer MVP 070-3 (defective)配置
Audit to verify The AWB has the versatility to perform aligned Anodic, Eutectic, Direct (High & Low Temperature) Glass frit, Adhesive, Solder & Thermo-compression wafer bonding. Alignment & bonding in one machine - Wafer size 8" - 8" standard IR platens for forces up to 15kN - IR and vis alignment - Twin Microscope ? camera system with through the-lens illumination. Two CCD cameras and side-by side display of images. Including IR capability. - In-situ alignment up to 1 micron accuracy - 10-6mbar Vacuum to 2bar process gas - forced nitrogen cooling - Voltage up to 2.5kV - Temperature up to 560° C - Semi-automatic PC control & data acquisitionOEM 型号描述
Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading文件
无文件