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APPLIED MICROENGINEERING LTD (AML) ROCK 08
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option
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    APPLIED MICROENGINEERING LTD (AML)

    ROCK 08

    verified-listing-icon

    已验证

    类别
    Wafer Bonders

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    Installed / Idle


    产品编号:

    80255


    晶圆尺寸:

    6"/150mm


    年份:

    2020

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    APPLIED MICROENGINEERING LTD (AML) ROCK 08

    APPLIED MICROENGINEERING LTD (AML)

    ROCK 08

    Wafer Bonders
    年份: 2020状况: 二手
    上次验证30 多天前

    APPLIED MICROENGINEERING LTD (AML)

    ROCK 08

    verified-listing-icon
    已验证
    类别
    Wafer Bonders
    上次验证: 30 多天前
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/08ae3840b2ca4df8a486324d696dd46c_6af6779701434a7994e221837144ba8f_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/a60f8200fa2847ab9fbe701193cc972d_fcad5caadaa3422cade5032099fa53821201a_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/6866b811f5fe4f84a93c0c93f9c12225_4e67ec6301294fd991e84f75e3721699_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/9f8f0351edd847fe8628be394d68ea71_8ae6dc3266204a13ac41fae7798d35b4_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/9ce1479f767a441eaf5ce1a107c91094_02bdb7680a5c4c229e3ad8131c4cedba_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/5060c077a8be45ec9a6de2e0fccc6532_50e200b8239c4db1a5a93fbf312626e1_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/6d32e3b2cc6f4f1a8db2f2d20fff0b47_977309334b424127bbd04a508c9bf5f3_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/84b7c0442f38448f99a6f2f4d40e3c12_3c0bedd583cf4f1ebea872e4193e96e1_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/9fa48e89e36e43ee9e2d6548ffc5d651_32a7dcf16141452a833370f90f56fdf41201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    Installed / Idle


    产品编号:

    80255


    晶圆尺寸:

    6"/150mm


    年份:

    2020


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option
    文件

    无文件

    类似上架物品
    查看全部
    APPLIED MICROENGINEERING LTD (AML) ROCK 08

    APPLIED MICROENGINEERING LTD (AML)

    ROCK 08

    Wafer Bonders年份: 2020状况: 二手上次验证: 30 多天前