说明
无说明配置
无配置OEM 型号描述
Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option文件
无文件
APPLIED MICROENGINEERING LTD (AML)
ROCK 08
已验证
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Idle
产品编号：
80255
晶圆尺寸：
6"/150mm
年份：
2020
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MICROENGINEERING LTD (AML)
ROCK 08
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Idle
产品编号：
80255
晶圆尺寸：
6"/150mm
年份：
2020
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option文件
无文件