说明
无说明配置
Permanent Bonding System GEMINI (Thermo-compression bonding) with 4 process chambers and a tooling for 6” (8” with other tooling possible).OEM 型号描述
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.文件
无文件
EVGroup (EVG)
GEMINI
已验证
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
65989
晶圆尺寸：
8"/200mm
年份：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
EVGroup (EVG)
GEMINI
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
65989
晶圆尺寸：
8"/200mm
年份：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Permanent Bonding System GEMINI (Thermo-compression bonding) with 4 process chambers and a tooling for 6” (8” with other tooling possible).OEM 型号描述
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.文件
无文件