说明
Wafer Bonding配置
无配置OEM 型号描述
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.文件
无文件
类别
Wafer Bonders
上次验证： 18 天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
149246
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
GEMINI FB
类别
Wafer Bonders
上次验证： 18 天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
149246
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Bonding配置
无配置OEM 型号描述
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.文件
无文件