跳至主要内容
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
EVGroup (EVG) EVG520IS
    说明
    Wafer Bonder
    配置
    无配置
    OEM 型号描述
    The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.
    文件

    无文件

    EVGroup (EVG)

    EVG520IS

    verified-listing-icon

    已验证

    类别
    Wafer Bonders

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    105001


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    EVGroup (EVG) EVG520IS

    EVGroup (EVG)

    EVG520IS

    Wafer Bonders
    年份: 2006状况: 二手
    上次验证60 多天前

    EVGroup (EVG)

    EVG520IS

    verified-listing-icon
    已验证
    类别
    Wafer Bonders
    上次验证: 60 多天前
    listing-photo-d3926a105f78438ba6a54c6c58f63cc8-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    105001


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Wafer Bonder
    配置
    无配置
    OEM 型号描述
    The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.
    文件

    无文件

    类似上架物品
    查看全部
    EVGroup (EVG) EVG520IS

    EVGroup (EVG)

    EVG520IS

    Wafer Bonders年份: 2006状况: 二手上次验证:60 多天前
    EVGroup (EVG) EVG520IS

    EVGroup (EVG)

    EVG520IS

    Wafer Bonders年份: 0状况: 二手上次验证:60 多天前
    EVGroup (EVG) EVG520IS

    EVGroup (EVG)

    EVG520IS

    Wafer Bonders年份: 0状况: 二手上次验证:60 多天前