说明
Condition: Complete / Working Status: Installed / Running配置
EVG 850LT Bonder Configured: 200mm Process: Fusion Bond Vacuum: 0.1Torr Temp range: Ambient Aligner: Wafer Edge Aligner Robot type: Genmark (1) Plamsa Chamber (1) Clean/Rinse module IR Module: NoOEM 型号描述
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer Bonder文件
无文件
EVGroup (EVG)
EVG850 LT
已验证
类别
Wafer Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
113644
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 LT
类别
Wafer Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
113644
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Condition: Complete / Working Status: Installed / Running配置
EVG 850LT Bonder Configured: 200mm Process: Fusion Bond Vacuum: 0.1Torr Temp range: Ambient Aligner: Wafer Edge Aligner Robot type: Genmark (1) Plamsa Chamber (1) Clean/Rinse module IR Module: NoOEM 型号描述
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes. Wafer Bonder文件
无文件