说明
Die-Bonder配置
无配置OEM 型号描述
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher-performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high-quality single-crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning and alignment to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers up to 300 mm sizes. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market.文件
无文件
EVGroup (EVG)
EVG850
已验证
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
41197
晶圆尺寸：
8"/200mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
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EVGroup (EVG)
EVG850
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
41197
晶圆尺寸：
8"/200mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Die-Bonder配置
无配置OEM 型号描述
Automated production bonding system for a wide range of fusion/molecular wafer bonding applications SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher-performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high-quality single-crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning and alignment to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers up to 300 mm sizes. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market.文件
无文件