说明
Wafer Cleaner配置
无配置OEM 型号描述
The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.文件
无文件
EVGroup (EVG)
EVG301
已验证
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
104999
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG301
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
104999
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Cleaner配置
无配置OEM 型号描述
The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.文件
无文件