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EVGroup (EVG) EVG510
    说明
    Peasants
    配置
    无配置
    OEM 型号描述
    The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes. Wafer Bonder
    文件

    无文件

    EVGroup (EVG)

    EVG510

    verified-listing-icon

    已验证

    类别
    Wafer Bonders

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    101272


    晶圆尺寸:

    12"/300mm


    年份:

    2023


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    EVGroup (EVG) EVG510

    EVGroup (EVG)

    EVG510

    Wafer Bonders
    年份: 0状况: 二手
    上次验证60 多天前

    EVGroup (EVG)

    EVG510

    verified-listing-icon
    已验证
    类别
    Wafer Bonders
    上次验证: 60 多天前
    listing-photo-3d00a20b0daf4d359244105dad20d2e7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/3d00a20b0daf4d359244105dad20d2e7/e1d486f0a35e4e0688c12e8b51ad023e_1_mw.png
    listing-photo-3d00a20b0daf4d359244105dad20d2e7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/3d00a20b0daf4d359244105dad20d2e7/ff2adb5ed39d46fc9928c4fb5f43bd6b_4_mw.png
    listing-photo-3d00a20b0daf4d359244105dad20d2e7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/3d00a20b0daf4d359244105dad20d2e7/895709df64454c938abfd29173ce26cf_2_mw.png
    listing-photo-3d00a20b0daf4d359244105dad20d2e7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/3d00a20b0daf4d359244105dad20d2e7/844c04d64f2a45a09cf814bc50937e54_3_mw.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    101272


    晶圆尺寸:

    12"/300mm


    年份:

    2023


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Peasants
    配置
    无配置
    OEM 型号描述
    The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes. Wafer Bonder
    文件

    无文件

    类似上架物品
    查看全部
    EVGroup (EVG) EVG510

    EVGroup (EVG)

    EVG510

    Wafer Bonders年份: 0状况: 二手上次验证:60 多天前
    EVGroup (EVG) EVG510

    EVGroup (EVG)

    EVG510

    Wafer Bonders年份: 2023状况: 二手上次验证:60 多天前
    EVGroup (EVG) EVG510

    EVGroup (EVG)

    EVG510

    Wafer Bonders年份: 2023状况: 二手上次验证:60 多天前