说明
Automated Bonding System配置
无配置OEM 型号描述
The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.文件
类别
Wafer Bonders
上次验证： 4 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
145564
晶圆尺寸：
未知
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG560
类别
Wafer Bonders
上次验证： 4 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
145564
晶圆尺寸：
未知
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available