BA8
概述
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder
活动的上架物品
1
服务
检验、保险、评估、物流
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder
1
检验、保险、评估、物流