说明
Contact Aligner配置
无配置OEM 型号描述
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder文件
无文件
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Idle
产品编号：
116406
晶圆尺寸：
未知
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
BA8
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Idle
产品编号：
116406
晶圆尺寸：
未知
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Contact Aligner配置
无配置OEM 型号描述
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder文件
无文件