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SUSS SB6e SUBSTRATE BONDER FOR EUTECTIC & FUSION BONDING CONSISTING OF: SB6e BASE MACHINE -Offering Flexibility and accuracy for production and/or laboratory wafer bonding of two or more wafers. All known wafer bond processes supported with user friendly software allowing unlimited variations of process parameters for the bonding of aligned substrates 50mm to 150mm in diameter. Aligned bonding requires a SUSS MA/BA, BA6, or BA. Transport fixture(s) must be ordered according to size of materials intended to be bonded. Base machine specifics: -Manual loading/unloading of aligned wafer transport fixture. Easy process programming Automatic process data recording with selectable interval Polished stainless steel cabinet Motorized Z axis Transport fixture loading slide Media Supplies: 208-230V/15A/50-60Hz - clean dry air (CDA) - 6 bar - process nitrogen 7 - 7.5 bar - vacuum 100 mbar(abs) for pressure bond tools Suss SB6e process chamber -Process bond chamber with software controllable insertion of gases such as O2 & inert gases. Small automated open/close process chamber door with integrated safety light barrier Automatic chamber purge during process door cycling to avoid chamber contamination during fixture load & unload. Class 1 clean room compatible Innovative rigid design PC for SB6e Pentium-based PC -Windows operating system CD drive, Ethernet network card PC flat panel monitor Windows-Based SB6e Software System One time non transferable Suss software license included Hot Chuck(s) SB6e -Lower hot bond chuck with temperature control from ambient to 550C. Resistive heater with active air cooling. Temperature uniformity +/- 2% Kit, Upstream Control -For bonding from atmospheric pressure down to of 5e-5 mbar(with turbo pump option) Downstream Controller -Pressure range: absolute 1 - 2000 mBar, up to 3000mBar With overpressure kit option Flow between 0.5 & 13 l/min (depending on pressure) Adjustable by manual valve PRESSURE HEAD -Cylinder, Bellows and control system / pressure doublers allows up to 20kN process force application with 150mm wafers. Required when ordering bond head option Includes linear guide bearing for high accuracy linear Movement of bond head Kit, 6.5 CFM Scroll Pump & Turbo Pump -For high vacuum to 5e-5 mbar -Turbomolecular pump -Scroll pump: 6.5 cfm@60 Hz Dry, Lubricant free Chemically resistant Kit, Multiple Process Gasses -Manually controlled valve for on / off control of up to (3) process gasses in chamber BOND-HEAD W/ Center Pin -For anodic, thermo compression, eutectic and adhesive bonding of wafers and pieces from 25mm - 150mm. -Force range capability 300N - 20KN with a 150mm wafer -Flat bond tool with thermal insulated, contamination free, exchangeable ceramic surface. -Spring loaded center pin -Heater temperature range: ambient - 500 degC PRESSURE PLATE KIT, A-150e/SiC/NO CP/W-100 -Silicon Carbide pressure plate for bonding of 100mm wafers -For bond head without center pin -Conductive, good for all types of bonding PRESSURE PLATE KIT, A-150e/SiC/CP/W-100 -Silicon Carbide pressure plate for bonding of 100mm wafers -Has hole for center pin -Conductive, good for all types of bonding BA8 closed fixture pneumatics kit - Needed for use of Closed Fixtures Closed Fixture for SB6e A-150/W-100 -Holds wafers in alignment for insertion into bonder -Compatible with Suss MA/BA or BA with AA26 or AA33 optics -For 100mm , closed design -SiC internal plate replaces sandwich plate Deliverable: -One (1) A-150/W-100 closed fixture with clamp arms -Five (5) fixture graphite foils NOTE: Graphite foil under closed fixture must be replaced on a regular basis. Foil changing frequency will be process dependent. SPACER FLAG, GEN IV, TYPE-A/W-100/0.1THK/SST -Install on transport fixture to hold clamped wafers apart. -For 100mm wafers -100 microns thick, Stainless Steel, TiN coated

OEM 型号描述

The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C. Wafer Bonder