We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
2012 Suss Microtec CB200 High Pressure Bonding Chamber配置
无配置OEM 型号描述
Wafer Bonder文件
无文件
PREFERRED
SELLER
类别
Wafer Bonders
上次验证： 30 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120635
晶圆尺寸：
未知
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
SUSS MicroTec / KARL SUSS
CB200
类别
Wafer Bonders
上次验证： 30 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120635
晶圆尺寸：
未知
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
2012 Suss Microtec CB200 High Pressure Bonding Chamber配置
无配置OEM 型号描述
Wafer Bonder文件
无文件