说明
无说明配置
无配置OEM 型号描述
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.文件
无文件
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
131745
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TOSEI
W-GM-4200
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
131745
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The W-GM-4200 is an edge grinding machine for wafer manufacturing up to 200 mm in diameter. It is produced by ACCRETECH and has a wide scope of application, high grinding precision, compact design, and is easy to operate. It is suitable for various wafer materials, such as GaAs, SiC, GaN, etc. The machine has a newly developed grinding unit for better rotational precision of the spindle and the profile sharpness.文件
无文件