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说明
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.配置
PG3000RM/200RMOEM 型号描述
未提供文件
无文件
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79210
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG3000RM
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79210
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.配置
PG3000RM/200RMOEM 型号描述
未提供文件
无文件