说明
无说明配置
无配置OEM 型号描述
The MPC™ 2000 Integrated Circuit Cross-Sectioning Semi Automated System is designed to accurately remove a pre-specified amount of material from microelectronic devices, and micro-components. Accurate cross-sectioning within +/-1um of a target feature is possible due to a combination of the precision power head, the low run-out tri-point drive plate, and the lapped, stainless-steel precision platen.This high accuracy reduces the possibility of grinding beyond the target plane which would be detrimental in failure analysis work.文件
无文件
Bühler / BUEHLER
MPC 2000
已验证
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68020
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Bühler / BUEHLER
MPC 2000
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68020
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The MPC™ 2000 Integrated Circuit Cross-Sectioning Semi Automated System is designed to accurately remove a pre-specified amount of material from microelectronic devices, and micro-components. Accurate cross-sectioning within +/-1um of a target feature is possible due to a combination of the precision power head, the low run-out tri-point drive plate, and the lapped, stainless-steel precision platen.This high accuracy reduces the possibility of grinding beyond the target plane which would be detrimental in failure analysis work.文件
无文件