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说明
无说明配置
无配置OEM 型号描述
The MPC™ 2000 Integrated Circuit Cross-Sectioning Semi Automated System is designed to accurately remove a pre-specified amount of material from microelectronic devices, and micro-components. Accurate cross-sectioning within +/-1um of a target feature is possible due to a combination of the precision power head, the low run-out tri-point drive plate, and the lapped, stainless-steel precision platen.This high accuracy reduces the possibility of grinding beyond the target plane which would be detrimental in failure analysis work.文件
无文件
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68020
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Bühler / BUEHLER
MPC 2000
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
68020
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The MPC™ 2000 Integrated Circuit Cross-Sectioning Semi Automated System is designed to accurately remove a pre-specified amount of material from microelectronic devices, and micro-components. Accurate cross-sectioning within +/-1um of a target feature is possible due to a combination of the precision power head, the low run-out tri-point drive plate, and the lapped, stainless-steel precision platen.This high accuracy reduces the possibility of grinding beyond the target plane which would be detrimental in failure analysis work.文件
无文件