说明
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.配置
无配置OEM 型号描述
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.文件
无文件
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DISCO
DAG810
类别
Wafer Grinding
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
140557
晶圆尺寸：
未知
年份：
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.配置
无配置OEM 型号描述
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.文件
无文件