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DISCO DFG841
    说明
    无说明
    配置
    FULL-AUTO
    OEM 型号描述
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    文件

    无文件

    DISCO

    DFG841

    verified-listing-icon

    已验证

    类别
    Wafer Grinding

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    63113


    晶圆尺寸:

    4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm


    年份:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding
    年份: 2000状况: 零件工具
    上次验证14 天前

    DISCO

    DFG841

    verified-listing-icon
    已验证
    类别
    Wafer Grinding
    上次验证: 60 多天前
    listing-photo-74465ec0ba7944308a724d107b79576a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    63113


    晶圆尺寸:

    4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm


    年份:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    FULL-AUTO
    OEM 型号描述
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    文件

    无文件

    类似上架物品
    查看全部
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding年份: 2000状况: 零件工具上次验证:14 天前
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding年份: 0状况: 二手上次验证:60 多天前
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding年份: 1998状况: 二手上次验证:60 多天前