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Specification Unit DFG8540 DFG8560 Wafer diameter - 08" 300 (04"/5"/6"/8") (0 200/ 300) Grinding method - In-feed grinding with wafer Rotation Griding wheels mm 200( 8") 300 Diamond wheel Diamond wheel Rated output kW 4.2 4.8 Spindle Rated torqu min 1,000 ~ 4,000 1,000 ~ 7,000 range Grinding Accuracy BG Thickness 1.5 or less 3.0 or less variation within one wafer um (with dedicated (with dedicated chuck table) chuck table, 300mm wafer Thickness variation between wafers um +3.0 or less Finished Ry 0.13(with #2000 finish) surface um Ry 0.15(with #1400 finish) roughness Machine mm 1,200 x 2,670 1,400 x 3,322 dimensions(WxDxH) x 1,800 x 1,800 Machine Weight: Kg Approx.3,100 Approx. 4,000OEM 型号描述
The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.文件
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DISCO
DFG8540
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79160
晶圆尺寸：
未知
年份：
未知
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