说明
WAFER GRINDING / GNX200 from ATK(CR17035 L*W*H (cm) -140x255x180 Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um.配置
无配置OEM 型号描述
Grinder文件
无文件
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OKAMOTO
GNX 200
类别
Wafer Grinding
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
143420
晶圆尺寸：
未知
年份：
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
WAFER GRINDING / GNX200 from ATK(CR17035 L*W*H (cm) -140x255x180 Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um.配置
无配置OEM 型号描述
Grinder文件
无文件