说明
12" Wafer Back Grinder GNX-300 L*W*H (cm) -140x255x180 �Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um. 3.Hub Port 4. CPU board配置
无配置OEM 型号描述
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文件
无文件
OKAMOTO
GNX 300
类别
Wafer Grinding
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
143426
晶圆尺寸：
12"/300mm
年份：
2003
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
12" Wafer Back Grinder GNX-300 L*W*H (cm) -140x255x180 �Weight (kg) -� 6000 1. Can't support 12" wafer 2. Unable to operate in products with a thickness of less than 300um. 3.Hub Port 4. CPU board配置
无配置OEM 型号描述
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文件
无文件