说明
Wafer Grinding配置
无配置OEM 型号描述
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "文件
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STRASBAUGH
7AF
已验证
类别
Wafer Grinding
上次验证： 6 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116964
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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STRASBAUGH
7AF
类别
Wafer Grinding
上次验证： 6 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116964
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Grinding配置
无配置OEM 型号描述
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "文件
无文件