概述

The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.