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说明
无说明配置
无配置OEM 型号描述
The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.文件
无文件
CHAD
WLM-2300
类别
Wafer Handling
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
98166
晶圆尺寸：
未知
年份：
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.文件
无文件