说明
无说明配置
无配置OEM 型号描述
The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.文件
无文件
CHAD
WLM-2300
已验证
类别
Wafer Handling
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
98166
晶圆尺寸：
未知
年份：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CHAD
WLM-2300
类别
Wafer Handling
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
98166
晶圆尺寸：
未知
年份：
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.文件
无文件