说明
无说明配置
无配置OEM 型号描述
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.文件
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ENGIS
EJD-9BL
类别
Wafer Lapping
上次验证： 4 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
140401
晶圆尺寸：
未知
年份：
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.文件
无文件