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说明
Double Side Polisher/Lapper Powered on testing is available配置
16BF/N Maximum Processing Diameter: mm Work diameter maximum: 335 Carrier specification: DP12×Z200 Carrier root circle: 417.55 Lower plate maximum rotation number: 70 Machine W×D×H: 1890×1410×3110 Machine Weight: 7000OEM 型号描述
The Hamei 16B is an innovative lapping machine featuring a non-rotating upper plate design. The upper plate is suspended using a wire, enabling it to effectively track plate movement, resulting in significantly improved productivity. By implementing mass-production techniques, we aim to reduce the overall costs of these machines while maintaining their exceptional performance.文件
无文件
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
123151
晶圆尺寸：
未知
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
HAMAI
16B
类别
Wafer Lapping
上次验证： 25 天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
123151
晶圆尺寸：
未知
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Double Side Polisher/Lapper Powered on testing is available配置
16BF/N Maximum Processing Diameter: mm Work diameter maximum: 335 Carrier specification: DP12×Z200 Carrier root circle: 417.55 Lower plate maximum rotation number: 70 Machine W×D×H: 1890×1410×3110 Machine Weight: 7000OEM 型号描述
The Hamei 16B is an innovative lapping machine featuring a non-rotating upper plate design. The upper plate is suspended using a wire, enabling it to effectively track plate movement, resulting in significantly improved productivity. By implementing mass-production techniques, we aim to reduce the overall costs of these machines while maintaining their exceptional performance.文件
无文件