说明
无说明配置
Back Grinder tape manual mounter for 6 and 8in wafersOEM 型号描述
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.文件
无文件
ULTRON SYSTEMS INC / USI
UH108-8
已验证
类别
Wafer Lapping
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
90074
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULTRON SYSTEMS INC / USI
UH108-8
类别
Wafer Lapping
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
90074
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Back Grinder tape manual mounter for 6 and 8in wafersOEM 型号描述
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.文件
无文件