说明
Spindle(NCPZ-110117)POLISH配置
无配置OEM 型号描述
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.文件
无文件
DISCO
DGP8760
已验证
类别
Wafer Polishing
上次验证： 26 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115340
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DGP8760
类别
Wafer Polishing
上次验证： 26 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115340
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Spindle(NCPZ-110117)POLISH配置
无配置OEM 型号描述
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.文件
无文件