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+DFM2700OEM 型号描述
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.文件
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DISCO
DGP8760
类别
Wafer Polishing
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
125959
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
2006
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说明
无说明配置
+DFM2700OEM 型号描述
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.文件
无文件