说明
无说明配置
无配置OEM 型号描述
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.文件
无文件
DISCO
DFP8141
已验证
类别
Wafer Polishing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
112290
晶圆尺寸：
未知
年份：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFP8141
类别
Wafer Polishing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
112290
晶圆尺寸：
未知
年份：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.文件
无文件