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IPEC / WESTECH AVANTI 372M
    说明
    Multi-Process CMP
    配置
    Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II Interface
    OEM 型号描述
    未提供
    文件

    无文件

    IPEC / WESTECH

    AVANTI 372M

    verified-listing-icon

    已验证

    类别
    Wafer Polishing

    上次验证: 18 天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    83267


    晶圆尺寸:

    8"/200mm


    年份:

    1997


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    IPEC / WESTECH AVANTI 372M

    IPEC / WESTECH

    AVANTI 372M

    Wafer Polishing
    年份: 1997状况: 二手
    上次验证18 天前

    IPEC / WESTECH

    AVANTI 372M

    verified-listing-icon
    已验证
    类别
    Wafer Polishing
    上次验证: 18 天前
    listing-photo-395b2ee9e4e8492ebd59e17c211f4325-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1372/395b2ee9e4e8492ebd59e17c211f4325/70c3dc2348234e9a82ad6f0e923a4bf7_b1e91c4da3f64eea9abd178eb903bd4e1201a_mw.jpeg
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    listing-photo-395b2ee9e4e8492ebd59e17c211f4325-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1372/395b2ee9e4e8492ebd59e17c211f4325/f9517ba866824baca276602ad463c01a_9e03db59913b4338920f3ab0563c89451201a_mw.jpeg
    listing-photo-395b2ee9e4e8492ebd59e17c211f4325-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1372/395b2ee9e4e8492ebd59e17c211f4325/e979f56ee53b42f9914a40f1490434fb_d154869049784e26981f993df2d7b51e1201a_mw.jpeg
    listing-photo-395b2ee9e4e8492ebd59e17c211f4325-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1372/395b2ee9e4e8492ebd59e17c211f4325/373626b4b4c2484da70a349b6836b639_748f117df27643b3848f9c31fdb8ead71201a_mw.jpeg
    listing-photo-395b2ee9e4e8492ebd59e17c211f4325-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1372/395b2ee9e4e8492ebd59e17c211f4325/60855a64a59e4b07bd7748096ec9729c_3e1fbbf6d2224a80a3a6466caddcb7e21201a_mw.jpeg
    listing-photo-395b2ee9e4e8492ebd59e17c211f4325-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1372/395b2ee9e4e8492ebd59e17c211f4325/fb792d54296e408584194502c815792c_16bc3ea2e25b4f2da8dbd55d846f556a1201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    83267


    晶圆尺寸:

    8"/200mm


    年份:

    1997


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Multi-Process CMP
    配置
    Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II Interface
    OEM 型号描述
    未提供
    文件

    无文件

    类似上架物品
    查看全部
    IPEC / WESTECH AVANTI 372M

    IPEC / WESTECH

    AVANTI 372M

    Wafer Polishing年份: 1997状况: 二手上次验证:18 天前
    IPEC / WESTECH AVANTI 372M

    IPEC / WESTECH

    AVANTI 372M

    Wafer Polishing年份: 1995状况: 二手上次验证:60 多天前
    IPEC / WESTECH AVANTI 372M

    IPEC / WESTECH

    AVANTI 372M

    Wafer Polishing年份: 0状况: 二手上次验证:26 天前