跳至主要内容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多

Moov logo

Moov Icon
LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
  • LOGITECH 1CM53
说明
Logitech CDP 1CM53 Chemical Delayering & Planarization CMP Polisher System ***This unit looks to be in great condition. It was excess stock from a refurbishment company. There are 2 connectors that are not plugged in to anything in the bottom. We do not have the facility requirements or expertise to test this unit. We are selling it as-is, for parts or not working as such.*** Key Features: Minimal subsurface damage Wide range of wafer sizes can be polished, up to 200 mm to single integrated circuit (IC) capability Robust, corrosion resistant construction Fine etch polishing of semiconductor wafers and electro-optic crystals Automated process control for repeatable results Description: The CDP automatic allows the operator to achieve industry standards of control and layer removal for traditional CMOS technology, CMP applications, such as STI and Damascene (acceptable Within Wafer Non-Uniformity (WIWNU) and Within Die Non-Uniformity (WIDNU) are achievable). The CDP automatic can also be used for non-traditional planarisation applications, such as hard substrate polishing, Epi-ready surface preparation or wafer reclamation, and will produce accurate and repeatable results to within required measurement parameters. Laser quality surfaces (0/0 scratch dig), improvements to surface topography and Ra to subnanometer levels on substrates are all achievable using the CDP automatic. This level of diversity makes the CDP ideal for the testing of new CMP slurries, pads and templates for off line analysis and for off line trials of new CMP processes without the need to stop production runs. Various process parameters such as: Platen rotational speed Carrier rotational speed, down force, and back pressure Carrier sweep speed and linear travel Platen temperature Slurry flow rate In-situ conditioning of the polishing pad Multiple memory locations for process storage
配置
Model Number: 1CM53 Power Requirements: 220-240 VAC, 50-60 Hz, Single Phase, 10 A CE Marked: Yes Additional Information: Platen Size: 19.625"~ Dia. Holder Size: 5"~ Dia. (I believe this is correct. I measured in between 2 white polymer plastic pieces.)
OEM 型号描述
未提供
文件

无文件

verified-listing-icon

已验证

类别
Wafer Polishing

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

Deinstalled / Uncrated


产品编号:

128815


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LOGITECH

1CM53

verified-listing-icon
已验证
类别
Wafer Polishing
上次验证: 60 多天前
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/10db4f78d8ae47ad8d1a41ff9c2341fd_logitech1cm53sn840107cmpsystem_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/bbcf1c08c65d41288e9c1f31201baaf0_logitech1cm53sn840107cmpsystem2_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/09e82b29da6740d99613fd3d5d9623c7_logitech1cm53sn840107cmpsystem3_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/eafb07f5646045fd8204596cab69ab19_logitech1cm53sn840107cmpsystem4_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/0d8bd906b7fc4bc3b47831704f31b048_logitech1cm53sn840107cmpsystem5_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/f7ee62ca53fa4d069080f3770eb2de11_logitech1cm53sn840107cmpsystem6_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/466f200eca044d24b07249005bce1ac0_logitech1cm53sn840107cmpsystem7_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/69643dfb8f4d4971948d58cb24c02e31_logitech1cm53sn840107cmpsystem8_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/37cca6006d8a4d38b5ccf67429248bdb_logitech1cm53sn840107cmpsystem9_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/8ae9f2d8f0a6449c929f9842846e7ed4_logitech1cm53sn840107cmpsystem10_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/d0fe753f8755459fa3c58f78508bcc27_logitech1cm53sn840107cmpsystem11_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/178dd4d975de4b3eb3d76f12c7e3b211_logitech1cm53sn840107cmpsystem12_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/f56a613df105462d99a59d68e6b56ffe_logitech1cm53sn840107cmpsystem13_mw.jpg
listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/33fde11102e64c47b43bffd89d21e41c_logitech1cm53sn840107cmpsystem14_mw.jpg
物品主要详细信息

状况:

Used


运行状况:

Deinstalled / Uncrated


产品编号:

128815


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Logitech CDP 1CM53 Chemical Delayering & Planarization CMP Polisher System ***This unit looks to be in great condition. It was excess stock from a refurbishment company. There are 2 connectors that are not plugged in to anything in the bottom. We do not have the facility requirements or expertise to test this unit. We are selling it as-is, for parts or not working as such.*** Key Features: Minimal subsurface damage Wide range of wafer sizes can be polished, up to 200 mm to single integrated circuit (IC) capability Robust, corrosion resistant construction Fine etch polishing of semiconductor wafers and electro-optic crystals Automated process control for repeatable results Description: The CDP automatic allows the operator to achieve industry standards of control and layer removal for traditional CMOS technology, CMP applications, such as STI and Damascene (acceptable Within Wafer Non-Uniformity (WIWNU) and Within Die Non-Uniformity (WIDNU) are achievable). The CDP automatic can also be used for non-traditional planarisation applications, such as hard substrate polishing, Epi-ready surface preparation or wafer reclamation, and will produce accurate and repeatable results to within required measurement parameters. Laser quality surfaces (0/0 scratch dig), improvements to surface topography and Ra to subnanometer levels on substrates are all achievable using the CDP automatic. This level of diversity makes the CDP ideal for the testing of new CMP slurries, pads and templates for off line analysis and for off line trials of new CMP processes without the need to stop production runs. Various process parameters such as: Platen rotational speed Carrier rotational speed, down force, and back pressure Carrier sweep speed and linear travel Platen temperature Slurry flow rate In-situ conditioning of the polishing pad Multiple memory locations for process storage
配置
Model Number: 1CM53 Power Requirements: 220-240 VAC, 50-60 Hz, Single Phase, 10 A CE Marked: Yes Additional Information: Platen Size: 19.625"~ Dia. Holder Size: 5"~ Dia. (I believe this is correct. I measured in between 2 white polymer plastic pieces.)
OEM 型号描述
未提供
文件

无文件