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说明
无说明配置
-Fully automated, dry-in/dry-out single wafer SiC substrate polisher -Configured for 150mm wafer processing -Milara, edge-contact dry robot on linear transfer platform -3 polish modules equipped with dedicated hardware -22" polish tables for constant-flow polish process -High pressure spray bar pad cleaner -Overam spindle with 4 passage rotary union -Slurry flow-controller for 2 lines per table -Integrated spray clean module with Jetspray and 2 fluid lines -Wet wafer transfer module with edge grip wafer flip robot to return wafer orientation to polish side up for cleaning -PEER Group, Windows based software architecture on a Beckhoff PLC control system with wafer lot and slot integrity -Semi S2, S8 and CE certification -Table temperture control unit -Universal Vacuum System -OCR camera -200mm wafer size conversion kit -6EZ Spare Parts KitOEM 型号描述
未提供文件
无文件
REVASUM
6EZ
类别
Wafer Polishing
上次验证： 29 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
108406
晶圆尺寸：
未知
年份：
2020
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Money Back Guarantee
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Refurbishment Services
Available
说明
无说明配置
-Fully automated, dry-in/dry-out single wafer SiC substrate polisher -Configured for 150mm wafer processing -Milara, edge-contact dry robot on linear transfer platform -3 polish modules equipped with dedicated hardware -22" polish tables for constant-flow polish process -High pressure spray bar pad cleaner -Overam spindle with 4 passage rotary union -Slurry flow-controller for 2 lines per table -Integrated spray clean module with Jetspray and 2 fluid lines -Wet wafer transfer module with edge grip wafer flip robot to return wafer orientation to polish side up for cleaning -PEER Group, Windows based software architecture on a Beckhoff PLC control system with wafer lot and slot integrity -Semi S2, S8 and CE certification -Table temperture control unit -Universal Vacuum System -OCR camera -200mm wafer size conversion kit -6EZ Spare Parts KitOEM 型号描述
未提供文件
无文件