说明
Planarizer Loader Unit Type: Carrier ENTEGRIS_PA194-60MB-61C02 Number Of Cassettes: - 2 lots at the same time - 4 cassettes inside the tool (2 sender, 2 receiver)配置
Throughput: ≃7 wafer/hour for 800sec of polishing/wafer CMPOEM 型号描述
6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.文件
无文件
类别
Wafer Polishing
上次验证： 8 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
145688
晶圆尺寸：
4"/100mm, 6"/150mm, 8"/200mm
年份：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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STRASBAUGH
6DS-SP
类别
Wafer Polishing
上次验证： 8 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
145688
晶圆尺寸：
4"/100mm, 6"/150mm, 8"/200mm
年份：
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Planarizer Loader Unit Type: Carrier ENTEGRIS_PA194-60MB-61C02 Number Of Cassettes: - 2 lots at the same time - 4 cassettes inside the tool (2 sender, 2 receiver)配置
Throughput: ≃7 wafer/hour for 800sec of polishing/wafer CMPOEM 型号描述
6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.文件
无文件