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说明
无说明配置
无配置OEM 型号描述
The DSS 200 Series II is a double-sided PVA scrubber that offers production-proven cleaning results for particles as small as 0.125µm. It can process wafers from 150mm to 200mm, with throughputs of 45-65 wafers per hour, making it a cost-effective wafer cleaning system. The system uses a simple brush scrubbing process to clean wafers, with both sides of the wafer being cleaned simultaneously and no edge exclusion. The unit features edge-only contact and an optional megasonic rinse sweep for effective cleaning results on metals and surface topography. A heat lamp assembly allows for fast dry cycles, with typical results showing a 200mm wafer can be dried in under 15 seconds using only an 1800 rpm spin cycle. At the end of the process, wafers are removed and placed in the output cassette by an edge gripping unload handler, with no contact of the wafer front or backside occurring from the spin module to the output cassette.文件
无文件
类别
Wafer Scrubber
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
68745
晶圆尺寸：
未知
年份：
1999
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
ONTRAK DSS200 II
类别
Wafer Scrubber
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
68745
晶圆尺寸：
未知
年份：
1999
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The DSS 200 Series II is a double-sided PVA scrubber that offers production-proven cleaning results for particles as small as 0.125µm. It can process wafers from 150mm to 200mm, with throughputs of 45-65 wafers per hour, making it a cost-effective wafer cleaning system. The system uses a simple brush scrubbing process to clean wafers, with both sides of the wafer being cleaned simultaneously and no edge exclusion. The unit features edge-only contact and an optional megasonic rinse sweep for effective cleaning results on metals and surface topography. A heat lamp assembly allows for fast dry cycles, with typical results showing a 200mm wafer can be dried in under 15 seconds using only an 1800 rpm spin cycle. At the end of the process, wafers are removed and placed in the output cassette by an edge gripping unload handler, with no contact of the wafer front or backside occurring from the spin module to the output cassette.文件
无文件