说明
无说明配置
无配置OEM 型号描述
The Velocity single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge. Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. Watermark-free performance is available with Sahara dry. The Velocity 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications.文件
无文件
AKRION
GOLDFINGER VELOCITY6
已验证
类别
Wet Benches - Auto
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
104626
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AKRION
GOLDFINGER VELOCITY6
类别
Wet Benches - Auto
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
104626
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Velocity single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge. Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. Watermark-free performance is available with Sahara dry. The Velocity 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications.文件
无文件