概述

V3 Compact Batch Immersion System offering either dry-to-dry or dry-to-wet processing with low exhaust requirements, few facility connections and easy maintenance access, while maintaining as much as a 20 percent footprint reduction over comparable tool sets. The V3 robot is designed to accommodate 150 mm or 200 mm wafers in standard cassettes for IC devices; alternate cassettes allow other materials to be processed using the standard robot arm. Suitable for R&D labs and applications.