说明
无说明配置
无配置OEM 型号描述
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.文件
无文件
类别
Wet Benches - Auto
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79548
晶圆尺寸：
6"/150mm
年份：
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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AS-2000
类别
Wet Benches - Auto
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79548
晶圆尺寸：
6"/150mm
年份：
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.文件
无文件