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说明
无说明配置
- Single wafer- Triton platform - 4 chamber with 2 spare slots - Operates full automated, dry in, dry out - 2 loadports for 200mm cassettes - The loadports can be equipped with sensors to map the wafer presence, including cross-slotting and double-slotting - 2x Edge grip end effectors for 200mm - 19'' touch screen display, operating system Windows 7 or newer, operating lanuage is English For more info, please see attahced doc.OEM 型号描述
From its inception to the first delivery in 2013, the Triton platform was designed to be a stable but modular workhorse for all single-wafer wet-processes. The modular build of our tools enables our customer to configure the tool for a mass-production single-process tool as well as a swiss-army knife R&D or prototyping tool – without affecting performance or reliability. -Processing of 3” to 450 mm substrates -Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber -Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistry文件
无文件
SEMSYSCO
TRITON
类别
Wet Benches - Auto
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
80310
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
- Single wafer- Triton platform - 4 chamber with 2 spare slots - Operates full automated, dry in, dry out - 2 loadports for 200mm cassettes - The loadports can be equipped with sensors to map the wafer presence, including cross-slotting and double-slotting - 2x Edge grip end effectors for 200mm - 19'' touch screen display, operating system Windows 7 or newer, operating lanuage is English For more info, please see attahced doc.OEM 型号描述
From its inception to the first delivery in 2013, the Triton platform was designed to be a stable but modular workhorse for all single-wafer wet-processes. The modular build of our tools enables our customer to configure the tool for a mass-production single-process tool as well as a swiss-army knife R&D or prototyping tool – without affecting performance or reliability. -Processing of 3” to 450 mm substrates -Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber -Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistry文件
无文件