说明
无说明配置
无配置OEM 型号描述
The EXPEDIUS™ -i is the latest auto wet station succeeding from the EXPEDIUS™ +, a platform featuring further improvements in process performance and productivity. The system has a highly cost effective solution designed for 45nm and beyond technology node for semiconductor manufacturing. The EXPEDIUS™ -i achieved a throughput of 1,000 wafers per hour (a 150% increase compared with the previous model), high productivity, and low Cost of Ownership. Implementation of the chemical treatment and pure water rinse tanks, well-optimized dryer module improves its cleaning and resist stripping performance significantly. The system realized greatly improvement both etch shape control and process stability for the selective etch process. Furthermore, in order to suppress pattern collapse of vulnerable structures, advanced dryer contributes to reduce processing time drastically and collaborate with optimum sequencing, the system achieved shortened throughput times and the highest level of cost performance in the industry.文件
无文件
类别
Wet Benches - Auto
上次验证： 7 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
141877
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
EXPEDIUS-i
类别
Wet Benches - Auto
上次验证： 7 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
141877
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The EXPEDIUS™ -i is the latest auto wet station succeeding from the EXPEDIUS™ +, a platform featuring further improvements in process performance and productivity. The system has a highly cost effective solution designed for 45nm and beyond technology node for semiconductor manufacturing. The EXPEDIUS™ -i achieved a throughput of 1,000 wafers per hour (a 150% increase compared with the previous model), high productivity, and low Cost of Ownership. Implementation of the chemical treatment and pure water rinse tanks, well-optimized dryer module improves its cleaning and resist stripping performance significantly. The system realized greatly improvement both etch shape control and process stability for the selective etch process. Furthermore, in order to suppress pattern collapse of vulnerable structures, advanced dryer contributes to reduce processing time drastically and collaborate with optimum sequencing, the system achieved shortened throughput times and the highest level of cost performance in the industry.文件
无文件