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AKRION GOLDFINGER VELOCITY6
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Velocity single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge. Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. Watermark-free performance is available with Sahara dry. The Velocity 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications.
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    AKRION

    GOLDFINGER VELOCITY6

    verified-listing-icon

    已验证

    类别
    Wet Processing / Wafer Cleaning

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    104626


    晶圆尺寸:

    未知


    年份:

    未知

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    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
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    AKRION GOLDFINGER VELOCITY6

    AKRION

    GOLDFINGER VELOCITY6

    Wet Processing / Wafer Cleaning
    年份: 0状况: 二手
    上次验证30 多天前

    AKRION

    GOLDFINGER VELOCITY6

    verified-listing-icon
    已验证
    类别
    Wet Processing / Wafer Cleaning
    上次验证: 30 多天前
    listing-photo-d7854e67fe124303afccadd487494424-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    104626


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The Velocity single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge. Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. Watermark-free performance is available with Sahara dry. The Velocity 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications.
    文件

    无文件

    类似上架物品
    查看全部
    AKRION GOLDFINGER VELOCITY6

    AKRION

    GOLDFINGER VELOCITY6

    Wet Processing / Wafer Cleaning年份: 0状况: 二手上次验证: 30 多天前