说明
无说明配置
无配置OEM 型号描述
Equinox is a single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing, and electroplating. It offers configurations from one to six chambers with a centralized controller and robotics. The platform is capable of performing various processes on substrates ranging from 3" to 200mm in size. It works by using a central dual end-effector robot to transfer substrates from cassette to chamber and back again. Equinox can help automate manual steps and transfers while increasing throughput with a small footprint. It offers ultra-clean dry-to-dry operation with uniform plating and etching results. The platform can integrate sequential process steps with a low cost of ownership (CoO) and provides a migration path from small R&D platforms to production systems with the same process chambers and control features.文件
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SEMITOOL
EQUINOX
已验证
类别
Wet Processing / Wafer Cleaning
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
111419
晶圆尺寸：
未知
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SEMITOOL
EQUINOX
类别
Wet Processing / Wafer Cleaning
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
111419
晶圆尺寸：
未知
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
Equinox is a single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing, and electroplating. It offers configurations from one to six chambers with a centralized controller and robotics. The platform is capable of performing various processes on substrates ranging from 3" to 200mm in size. It works by using a central dual end-effector robot to transfer substrates from cassette to chamber and back again. Equinox can help automate manual steps and transfers while increasing throughput with a small footprint. It offers ultra-clean dry-to-dry operation with uniform plating and etching results. The platform can integrate sequential process steps with a low cost of ownership (CoO) and provides a migration path from small R&D platforms to production systems with the same process chambers and control features.文件
无文件