说明
无说明配置
无配置OEM 型号描述
The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm文件
无文件
SEMITOOL
SST 421
已验证
类别
Wet processing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
36155
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMITOOL
SST 421
类别
Wet processing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
36155
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm文件
无文件